Jan 31, 2018

A PCB technology is able to take miniaturization to the next level


Source: Cicor RHe Microsystems GmbH
Jan 31, 2018
In microelectronics, the boundaries between thin film and printed circuit technology become increasingly blurred. Thin film technology works with materials, processes and machines from both fields and thereby aims to make great progress with regard to miniaturization. Cicor is a technological leader in these fields, not least due to the combination of printed circuit boards and thin film technology under one roof.

The DenciTec technology creates the opportunity for further miniaturization. The possibilities include conductor widths and spacings down to 25 µm with copper thicknesses of 20 +/- 5 µm on all conductive layers, laser-via diameters of 35 µm, annular rings with a diameter of 30 µm for the inner layers and 20 µm for the outer layers as well as copper-filled blind vias with the option of via stacking and vias-in-pads.

Furthermore, the use of advanced materials allows the production of ultra-thin circuits, including e.g. the manufacture of 4-layer flex circuits with a total thickness of less than 120 µm. This can be done whilst meeting the highest standards of product reliability.

With DenciTec technology, Cicor complements its spectrum of services with a solution that delivers highly miniaturized circuits of the highest reliability. Production output and production yield are in line with the usual values of PCB manufacturers. It enables a high density of integrated functions for printed circuit boards with high throughput and attractive costs.

Contact: Dr. Uwe Schindler, Cicor RHe Microsystems GmbH
info@cicor.com
 

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